Correct option is D
In the context of
SMD (Surface-Mount Device) IC packages,
DIP stands for
Dual In-line Package. It refers to a type of IC package with two parallel rows of pins, which can be inserted into sockets or soldered directly onto printed circuit boards (PCBs).
Key Features of DIP:
· Two rows of pins spaced evenly.
· Widely used in through-hole technology.
· Common in older and some modern electronic devices for easy handling and assembly.
